ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,582, issued on June 30, was assigned to Gwangju Institute of Science and Technology (Gwangju, South Korea). "Stretchable electronic device ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,583, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Light emitting diode structure including fr... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,584, issued on June 30, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,585, issued on June 30, was assigned to QUALCOMM Inc. (San Diego). "Package comprising an integrated device, a chiplet and a metallization ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,586, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic device packages including wirebonding and r... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,587, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for forming conductive bumps... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,588, issued on June 30, was assigned to Canon K.K. (Tokyo). "Semiconductor device and equipment" was invented by Hiroaki Kobayashi (Kanagaw... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,589, issued on June 30, was assigned to AUO Corp. (Hsinchu, Taiwan). "Panel structure and manufacturing method thereof" was invented by Shi... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,590, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods of forming microelectronic devices" was invented by... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,591, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Vertically stacked semiconductor de... Read More