US Patent Issued to Micron Technology on June 30 for "Microelectronic device packages including wirebonding and related methods, memory devices, and electronic systems" (Indian Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,586, issued on June 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic device packages including wirebonding and related methods, memory devices, and electronic systems" was invented by Akanksha Sahoo (Hyderabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device may include a carrier including a connection region and a routing region positioned at an angle relative to the connection region. The memory device may further include a wire bond coupled between at least one microelectronic device and the routing region of the carrier. The memory device may also include a support structure positioned adjacent the...