US Patent Issued to UNITED MICROELECTRONICS on June 30 for "Light emitting diode structure including front side electrodes connected to metal interconnects and method of manufacturing the same" (Singaporean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,583, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Light emitting diode structure including front side electrodes connected to metal interconnects and method of manufacturing the same" was invented by Zhibiao Zhou (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode (LED) structure is provided in the present invention, including a substrate, a dielectric layer on the substrate, metal interconnects in the dielectric layer, LED dies on the dielectric layer, wherein each LED die is provided with a front side and a back side, the back side is bonded with the dielectric layer, and t...