US Patent Issued to QUALCOMM on June 30 for "Package comprising an integrated device, a chiplet and a metallization portion" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,585, issued on June 30, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising an integrated device, a chiplet and a metallization portion" was invented by Xia Li (San Diego), Xuefeng Zhang (San Diego) and Aniket Patil (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate comprising at least one dielectric layer and a plurality of interconnects, a first chiplet coupled to the substrate, a second chiplet coupled to the first chiplet, an encapsulation layer coupled to the substrate, the first chiplet and the second chiplet, a plurality of encapsulation interconnects located in the encapsulation layer, a met...