ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,572, issued on June 30, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate with interconnects" was invented by Joan... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,573, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Flexible package" was invented by Wei... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,574, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bonding method" was invented by... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,575, issued on June 30, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method for arranging... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,576, issued on June 30, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Semiconductor structure and manufacturing method ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,577, issued on June 30, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device and manufac... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,578, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Cap layer for pad oxidation prevent... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,579, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,580, issued on June 30, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Method of manufacturing semiconductor package using double... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,581, issued on June 30, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China). "Mesa device with stack thin film passivati... Read More