US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on June 30 for "Semiconductor device and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,577, issued on June 30, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Semiconductor device and manufacturing method thereof" was invented by Tian Zeng (Wuhan, China), Di Zhan (Wuhan, China) and Guoliang Ye (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed in the present disclosure are a semiconductor device and manufacturing method thereof. The method comprises: bonding the front surface of a top wafer to the front surface of a first wafer, and enabling the front surface of the top wafer to face upwards and the front surface of the first wafer to face downwards; bonding the front surface of a...