US Patent Issued to Advanced Semiconductor Engineering on June 30 for "Flexible package" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,573, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Flexible package" was invented by Wei-Hao Chang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible package is provided. The flexible package includes a first carrier and a second carrier. The second carrier is electrically connected to the first carrier. The second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier."

The patent was filed on Sept. 20, 2022, under Application No. 17/949,142.

*For fur...