ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,062, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,063, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing method and plasma processing apparatus" was invente... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,064, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Yusuke Hayasaka (Miyagi,... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,065, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus and potential control method" was invente... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,066, issued on July 28, was assigned to Lam Research Corp. (Fremont, Calif.). "Moveable edge rings with reduced capacitance variation for s... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,067, issued on July 28, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Bottom and middle edge rings" was invented by Hiran Rajitha ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,068, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Focus ring and substrate processing apparatu... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,069, issued on July 28, was assigned to NITERRA Co. LTD. (Nagoya, Japan). "Holding device" was invented by Shun Usui (Nagoya, Japan), Shiro... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,070, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Multi-zone heater with minimum RF loss" was invented... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,071, issued on July 28, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate support assembly with improved thermal uni... Read More