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US Patent Issued to SOCIETE BIC on July 28 for "Writing gel ink" (French Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,409, issued on July 28, was assigned to SOCIETE BIC (Clichy, France). "Writing gel ink" was invented by Guillaume Caffier (Clichy, France) ... Read More


US Patent Issued to SOLUS ADVANCED MATERIALS on July 28 for "High temperature stability epoxy resin composition and encapsulation material comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,410, issued on July 28, was assigned to SOLUS ADVANCED MATERIALS Co. LTD. (Iksan, South Korea). "High temperature stability epoxy resin com... Read More


US Patent Issued to TOKYO OHKA KOGYO on July 28 for "Method for suppressing collapse of three-dimensional structure" (American, Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,412, issued on July 28, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan). "Method for suppressing collapse of three-dimensional ... Read More


US Patent Issued to Fujifilm Electronic Materials U.S.A. on July 28 for "Polishing compositions and methods of use thereof" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,413, issued on July 28, was assigned to Fujifilm Electronic Materials U.S.A. Inc. (N. Kingstown, R.I.). "Polishing compositions and methods... Read More


US Patent Issued to FUJIMI on July 28 for "Polishing composition, production method of polishing composition, polishing method, and manufacturing method of semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,414, issued on July 28, was assigned to FUJIMI Inc. (Aichi, Japan). "Polishing composition, production method of polishing composition, pol... Read More


US Patent Issued to DISCO on July 28 for "Polishing liquid for polishing compound semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,415, issued on July 28, was assigned to DISCO Corp. (Tokyo). "Polishing liquid for polishing compound semiconductor substrate" was invented... Read More


US Patent Issued to 3M Innovative Properties on July 28 for "Release coating compositions for pressure sensitive adhesive articles and methods" (Minnesota Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,416, issued on July 28, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Release coating compositions for pressure sensitiv... Read More


US Patent Issued to 3M Innovative Properties on July 28 for "Adhesive tape" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,417, issued on July 28, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Adhesive tape" was invented by Yunshu Zhang (Shang... Read More


US Patent Issued to Shin-Etsu Chemical on July 28 for "Thermally conductive silicone adhesive composition and a thermally conductive composite" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,418, issued on July 28, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo). "Thermally conductive silicone adhesive composition and a ther... Read More


US Patent Issued to XINMEI FONTANA HOLDING (HONG KONG) on July 28 for "Pressure-sensitive adhesive" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,419, issued on July 28, was assigned to XINMEI FONTANA HOLDING (HONG KONG) Ltd. (Hong Kong). "Pressure-sensitive adhesive" was invented by ... Read More