ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,419, issued on July 28, was assigned to XINMEI FONTANA HOLDING (HONG KONG) Ltd. (Hong Kong).
"Pressure-sensitive adhesive" was invented by Jin Seo Min (Daejeon, South Korea), Hui Je Lee (Daejeon, South Korea), Hyun Woo Choi (Daejeon, South Korea) and Jae Sung Hong (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application may provide a pressure-sensitive adhesive with excellent reliability, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having exc...