US Patent Issued to Shin-Etsu Chemical on July 28 for "Thermally conductive silicone adhesive composition and a thermally conductive composite" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,418, issued on July 28, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo).

"Thermally conductive silicone adhesive composition and a thermally conductive composite" was invented by Takanori Ito (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to provide a thermally conductive silicone adhesive composition that provides excellent handling and sufficient adhesive strength. Additionally, the present invention aims to provide a composite with excellent strength and insulation.Described herein is a thermally conductive silicone adhesive composition, comprising the following components (a) to (e): (a) 100 parts by...