US Patent Issued to DISCO on July 28 for "Polishing liquid for polishing compound semiconductor substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,415, issued on July 28, was assigned to DISCO Corp. (Tokyo).

"Polishing liquid for polishing compound semiconductor substrate" was invented by Ayumu Sakai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing liquid for polishing a compound semiconductor substrate includes an aqueous solution in which a permanganate and a water-soluble compound are dissolved. The water-soluble compound is obtained by combination of a strong acid and a transition metal element. The transition metal element includes at least one element of Group III elements, lanthanoid, or Group IV elements. Concentrations of ammonium ions and ammonia contained in the aqu...