ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,996, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor device module comprising flexible lea... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,997, issued on Aug. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Power modules and related methods" wa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,999, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit device havin... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,000, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manufac... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,001, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,002, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Yoonyo... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,003, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Substrate" was invented by Alexander Hohn (Soest, G... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,004, issued on Aug. 11, was assigned to Infineon Technologies Canada Inc. (Ottawa). "Leaded package using routing layer for integrated circ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,005, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Driving circuit mounting film" was invented ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,006, issued on Aug. 11, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate having multiple build-up parts" was invented by M... Read More