US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,001, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Choongbin Yim (Suwon-si, South Korea) and Gitae Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution wiring layer including a first redistribution wiring, a semiconductor chip disposed on the first redistribution wiring layer, a plurality of interposer connectors disposed on the first redistribution wiring layer, each of the plurality of interposer connectors including a first surface fac...