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US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 11 for "Semiconductor structure, dicing method thereof, and memory" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,985, issued on Aug. 11, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor structure, dicing method thereo... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 11 for "Integrated circuit having a routable leadframe" (Texas Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,986, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit having a routable leadframe" was invented by B... Read More


US Patent Issued to Frontgrade Technologies on Aug. 11 for "Ball grid array assembly using a solder paste mix and method of using a solder paste dip" (Colorado Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,987, issued on Aug. 11, was assigned to Frontgrade Technologies Inc. (Colorado Springs, Colo.). "Ball grid array assembly using a solder pa... Read More


US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Power semiconductor package and method for fabricating the same" (Malaysian, German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,989, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power semiconductor package and method for fa... Read More


US Patent Issued to Samsung Display on Aug. 11 for "Semiconductor package film and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,990, issued on Aug. 11, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Semiconductor package film and manufacturing me... Read More


US Patent Issued to Rohm on Aug. 11 for "Semiconductor device provided with electroconductive support containing non-magnetic material for mounting semiconductor elements" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,991, issued on Aug. 11, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device provided with electroconductive support contain... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 11 for "Electronic device including vertical high current hall sensor with integrated heat slug current loop power pad" (Texas, California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,992, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Electronic device including vertical high current hall sensor wit... Read More


US Patent Issued to Advanced Semiconductor Engineering on Aug. 11 for "Package structure and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,993, issued on Aug. 11, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Package structure and method of manuf... Read More


US Patent Issued to STMicroelectronics on Aug. 11 for "Method of manufacturing semiconductor devices and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,994, issued on Aug. 11, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Method of manufacturing semiconductor devices a... Read More


US Patent Issued to ROHM on Aug. 11 for "Semiconductor device with a surface of a semiconductor body exposed through an opening in a sealing resin" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,995, issued on Aug. 11, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device with a surface of a semiconductor body exposed ... Read More