US Patent Issued to Advanced Semiconductor Engineering on Aug. 11 for "Package structure and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,993, issued on Aug. 11, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package structure and method of manufacturing the same" was invented by Ying-Chung Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire."

The pat...