US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Power semiconductor package and method for fabricating the same" (Malaysian, German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,989, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Power semiconductor package and method for fabricating the same" was invented by Ralf Otremba (Kaufbeuren, Germany), Thai Kee Gan (Melaka, Malaysia), Teck Sim Lee (Melaka, Malaysia), Chwee Pang Tommy Khoo (Melaka, Malaysia), Christian Schiele (Munich), Katrin Unterhofer (Munich) and Patrick Uredat (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor package includes: a die carrier having first and second opposite sides; and first and second power semiconductor dies each having first and second power electrodes on opposite sides. The ...