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US Patent Issued to Powerchip Semiconductor Manufacturing on Aug. 11 for "Semiconductor device and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,695, issued on Aug. 11, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Semiconductor device and method for... Read More


US Patent Issued to Infineon Technologies on Aug. 11 for "Method for manufacturing a contact on a silicon carbide semiconductor substrate, and silicon carbide semiconductor device" (Austrian, German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,696, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Method for manufacturing a contact on a silicon car... Read More


US Patent Issued to Intel on Aug. 11 for "Heterogeneous metal line compositions for advanced integrated circuit structure fabrication" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,697, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Heterogeneous metal line compositions for advanced integrated c... Read More


US Patent Issued to Imec vzw on Aug. 11 for "Semiconductor device structure" (Belgian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,699, issued on Aug. 11, was assigned to Imec vzw (Leuven, Belgium). "Semiconductor device structure" was invented by Gaspard Hiblot (Leuven... Read More


US Patent Issued to Micron Technology on Aug. 11 for "Contact arrangements for transistors" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,700, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Contact arrangements for transistors" was invented by Yoshi... Read More


US Patent Issued to Infineon Technologies on Aug. 11 for "Trench power device with enhanced charge carrier mobility" (Austrian, German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,701, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Trench power device with enhanced charge carrier mo... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device including vertical channel pattern and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,702, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device including vertical c... Read More


US Patent Issued to UNITED MICROELECTRONICS on Aug. 11 for "Semiconductor structure and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,703, issued on Aug. 11, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan). "Semiconductor structure and method for fabricatin... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Method of forming a semiconductor device having gate spacers with regions of diffused silicon germanium" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,704, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of forming a semiconductor d... Read More


US Patent Issued to STMicroelectronics (Crolles 2) on Aug. 11 for "Siliciding method" (French Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,705, issued on Aug. 11, was assigned to STMicroelectronics (Crolles 2) SAS (Crolles, France). "Siliciding method" was invented by Magali Gr... Read More