US Patent Issued to Intel on Aug. 11 for "Heterogeneous metal line compositions for advanced integrated circuit structure fabrication" (Oregon Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,697, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Heterogeneous metal line compositions for advanced integrated circuit structure fabrication" was invented by Andrew W. Yeoh (Portland, Ore.), Joseph Steigerwald (Forest Grove, Ore.), Jinhong Shin (Portland, Ore.), Vinay Chikarmane (Portland, Ore.) and Christopher P. Auth (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integra...