ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,701, issued on April 14, was assigned to ATT Advanced Temperature Test Systems GmbH (Planegg, Germany). "Modular wafer-chuck system" was i... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,702, issued on April 14, was assigned to Diodes Inc. (Plano, Texas). "Calibration device" was invented by WanHui Li (Chengdu, China) and J... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,702, issued on April 14, was assigned to Diodes Inc. (Plano, Texas). "Calibration device" was invented by WanHui Li (Chengdu, China) and J... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,703, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Wafer chuck with thermal tuning cavity features" was inven... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,703, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Wafer chuck with thermal tuning cavity features" was inven... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,704, issued on April 14, was assigned to DISCO Corp. (Tokyo). "Wafer transfer method and wafer transfer apparatus" was invented by Kazuki ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,704, issued on April 14, was assigned to DISCO Corp. (Tokyo). "Wafer transfer method and wafer transfer apparatus" was invented by Kazuki ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,705, issued on April 14, was assigned to MiCo Ceramics Ltd. (Anseong-si, South Korea). "Ceramic susceptor" was invented by Hyung-Jun Cho (... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,705, issued on April 14, was assigned to MiCo Ceramics Ltd. (Anseong-si, South Korea). "Ceramic susceptor" was invented by Hyung-Jun Cho (... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,707, issued on April 14, was assigned to CANON K.K. (Tokyo). "Method including positioning a source die or a destination site to compensat... Read More