ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,704, issued on April 14, was assigned to DISCO Corp. (Tokyo).
"Wafer transfer method and wafer transfer apparatus" was invented by Kazuki Sugiura (Tokyo), Takashi Mori (Tokyo), Yoshinori Kakinuma (Tokyo), Tetsuya Hosono (Tokyo) and Kaoru Amano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is n...