US Patent Issued to Lam Research on April 14 for "Wafer chuck with thermal tuning cavity features" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,703, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.).

"Wafer chuck with thermal tuning cavity features" was invented by Siyuan Tian (Newark, Calif.) and Yuma Ohkura (San Mateo, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Wafer chucks or baseplates therefor are disclosed that feature thermal tuning cavity features that are positioned and sized so as to provide a more uniform temperature distribution across a wafer support surface of such a wafer chuck. Each thermal tuning cavity feature may be positioned adjacent to a portion or portions of a heat exchange passage or passages within a baseplate of the wafer chuck. ...