ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,210, issued on Aug. 25, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabrication met... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,211, issued on Aug. 25, was assigned to MITSUI KINZOKU COMPANY Ltd. (Tokyo). "Method for producing wiring board" was invented by Yukiko Kit... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,212, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Tsunehisa Ono (Kyoto, Japan). ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,213, issued on Aug. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming channels in encaps... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,214, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device and method of manufacturing the same" was i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,216, issued on Aug. 25, was assigned to NICHIA Corp. (Anan, Japan). "Image display device and method for manufacturing image display device... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,217, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,218, issued on Aug. 25, was assigned to Google LLC (Mountain View, Calif.). "Optical communication for memory disaggregation in high perfor... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,219, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit package and meth... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,220, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Methods of forming packages and res... Read More