US Patent Issued to DENSO on Aug. 25 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,214, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Sachio Kodama (Kariya-city, Japan), Hiroaki Yoshizawa (Kariya-city, Japan), Masanori Ooshima (Kariya-city, Japan) and Takahiro Hirano (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a sealing member, and a first conductive plate. The semiconductor element includes a first electrode. The sealing member seals the semiconductor element. The first conductive plate includes a first surface facing the first electrode inside the seali...