US Patent Issued to STATS ChipPAC on Aug. 25 for "Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstituted wafer" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,213, issued on Aug. 25, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstituted wafer" was invented by Jian Zuo (Singapore) and Lee Sun Lim (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a plurality of electrical components and an encapsulant deposited over the electrical components. A first saw street of the encapsulant separates a first electrical component from a second electrical component. A first channel is formed in a first surface of the encapsulant within the first saw street to reduce stress. A second ch...