US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,217, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Dongkyu Kim (Anyang-si, South Korea), Jongyoun Kim (Seoul, South Korea), Seokhyun Lee (Hwaseong-si, South Korea) and Minjung Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a base substrate including a lower redistribution layer; a lower semiconductor chip including a first active surface and on the base substrate; an upper semiconductor chip including a second active surface on the lower semiconductor chip and having an...