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US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Nonvolatile memory device and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,995, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Nonvolatile memory device and method for fabrica... Read More


US Patent Issued to SK hynix on May 5 for "Semiconductor integrated circuit device and method of manufacturing the semiconductor integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,996, issued on May 5, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor integrated circuit device and method of manufact... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,997, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices" was invented by Kiseok Le... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 5 for "Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)" (Taiwanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,998, issued on May 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method and structures pertaining to imp... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Variable resistance memory device" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,999, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Variable resistance memory device" was invent... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,000, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufacturin... Read More


US Patent Issued to Monolithic 3D on May 5 for "3D semiconductor device, structure and methods with memory arrays and connectivity structures" (American, Israeli Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,001, issued on May 5, was assigned to Monolithic 3D Inc. (Allen, Texas). "3D semiconductor device, structure and methods with memory arrays a... Read More


US Patent Issued to SK hynix on May 5 for "Semiconductor device including memory cell including thyristor and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,002, issued on May 5, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device including memory cell including thyristor... Read More


US Patent Issued to Adeia Semiconductor Solutions on May 5 for "High density three-dimensional integrated capacitors" (California Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,003, issued on May 5, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "High density three-dimensional integrated capaci... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 5 for "Semiconductor trench capacitor structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,004, issued on May 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor trench capacitor stru... Read More