US Patent Issued to Monolithic 3D on May 5 for "3D semiconductor device, structure and methods with memory arrays and connectivity structures" (American, Israeli Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,001, issued on May 5, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor device, structure and methods with memory arrays and connectivity structures" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.), Brian Cronquist (Klamath Falls, Ore.) and Eli Lusky (Ramat-Gan, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device including: a first level including a first single crystal layer and a memory control circuit including first transistors and control circuit connectivity provided by first, second, and third metal layers; a second level including second transistors (one which includes ...