ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,488, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including package cap"... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,489, issued on Sept. 8, was assigned to HRL LABORATORIES LLC (Malibu, Calif.). "Thermal management architecture for three-dimensional heter... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,490, issued on Sept. 8, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Electronic control device" was invented by Ryo Akiba (Hi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,491, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including lower semicon... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,492, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Integrated circuit package heat sink" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,493, issued on Sept. 8, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Power semiconductor device and manufacturing method" was... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,494, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor element bonding portion and semiconductor ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,495, issued on Sept. 8, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea). "Power module including multiple layers having varied ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,496, issued on Sept. 8, was assigned to POWER MASTER SEMICONDUCTOR Co. LTD. (Cheongju-si, South Korea). "Semiconductor device" was invented... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,497, issued on Sept. 8, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Method of direct cooling using a cond... Read More