ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,478, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Selective bottomless graphene lined interconnects" was invented... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,479, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit (IC) device with multilayer metal line" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,480, issued on Sept. 8, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Device for detecting an el... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,481, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Device having different first m... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,482, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Etch stop layer for backside processing architecture" was inven... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,483, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, China). "Transistor with source and drain via... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,484, issued on Sept. 8, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device containing multi-lev... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,485, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Passive devices in bonding laye... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,486, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Inductor performance enhancement using an outer, peripheral patterned g... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,487, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Young... Read More