US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Passive devices in bonding layers" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,485, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Passive devices in bonding layers" was invented by Yi Ching Ong (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu County, Taiwan), Chien Hung Liu (Hsinchu County, Taiwan), Harry-Haklay Chuang (Zhubei City, Taiwan), Yu-Sheng Chen (Taoyuan City, Taiwan), Yu-Jen Wang (Hsinchu City, Taiwan) and Kuo-Ching Huang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding lay...