US Patent Issued to Intel on Sept. 8 for "Integrated circuit (IC) device with multilayer metal line" (Oregon, New Mexico Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,479, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit (IC) device with multilayer metal line" was invented by Ilya V. Karpov (Portland, Ore.), Shafaat Ahmed (Albuquerque, N.M.), Matthew V. Metz (Portland, Ore.), Darren Anthony Denardis (Albuquerque, N.M.), Nafees Aminul Kabir (Hillsboro, Ore.) and Tristan A. Tronic (Aloha, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC device includes a multilayer metal line that is at least partially surrounded by one or more electrical insulators. The multilayer metal line may be formed by stacking four layers on top of one another. The four layers may include a ...