ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,468, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Metal structures with seams" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,469, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Gate contact structure" was inv... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,470, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Contact patterning" was invented by Hojin Kim (Albany, N.Y.), Minseok... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,471, issued on Sept. 8, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with liner layer ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,472, issued on Sept. 8, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual damascene fully-aligned via interconnec... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,473, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Selective deposition of barrier lay... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,474, issued on Sept. 8, was assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS INC. (Lowell, Mass.). "Unibody lateral via" was invented by And... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,475, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with dummy pads" was i... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,476, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method of fabric... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,477, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Damascene interconnect structures with low resistance vias for ... Read More