US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package with dummy pads" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,475, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package with dummy pads" was invented by Gwangjae Jeon (Suwon-si, South Korea), Minki Kim (Suwon-si, South Korea), Hyungchul Shin (Suwon-si, South Korea), Won Il Lee (Suwon-si, South Korea), Hyuekjae Lee (Suwon-si, South Korea) and Enbin Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads conne...