ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,472, issued on Sept. 8, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual damascene fully-aligned via interconnec... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,473, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Selective deposition of barrier lay... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,474, issued on Sept. 8, was assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS INC. (Lowell, Mass.). "Unibody lateral via" was invented by And... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,475, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with dummy pads" was i... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,476, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method of fabric... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,477, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Damascene interconnect structures with low resistance vias for ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,478, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Selective bottomless graphene lined interconnects" was invented... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,479, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit (IC) device with multilayer metal line" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,480, issued on Sept. 8, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Device for detecting an el... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,481, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Device having different first m... Read More