US Patent Issued to WINBOND ELECTRONICS on June 9 for "Semiconductor device and method forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,024, issued on June 9, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor device and method forming the same"... और पढ़ें

US Patent Issued to ChangXin Memory Technologies on June 9 for "Method of forming semiconductor structure and semiconductor structure" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,025, issued on June 9, was assigned to ChangXin Memory Technologies Inc. (Hefei, China). "Method of forming semiconductor structure and semi... और पढ़ें

US Patent Issued to Wolfspeed on June 9 for "Power semiconductor devices including multiple gate bond pads" (North Carolina Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,026, issued on June 9, was assigned to Wolfspeed Inc. (Durham, N.C.). "Power semiconductor devices including multiple gate bond pads" was in... और पढ़ें

US Patent Issued to Intel on June 9 for "Interconnect via metal-insulator-metal (MIM) fuse for integrated circuitry" (Arizona Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,027, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Interconnect via metal-insulator-metal (MIM) fuse for integrated ... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Packaged semiconductor device including liquid-cooled lid and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,028, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Packaged semiconductor device includi... और पढ़ें

US Patent Issued to UNITED SILICON CARBIDE on June 9 for "Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking" (New Jersey Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,029, issued on June 9, was assigned to UNITED SILICON CARBIDE INC. (Scottsdale, Ariz.). "Power block based on top-side cool surface-mount di... और पढ़ें

US Patent Issued to International Business Machines on June 9 for "Double-sided integrated circuit with electrostatic guard ring" (New York, Vermont, Connecticut Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,030, issued on June 9, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Double-sided integrated circuit with electrost... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Dummy dies for reducing warpage in packages" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,031, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Dummy dies for reducing warpage in pa... और पढ़ें

US Patent Issued to Innolux on June 9 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,032, issued on June 9, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Chia-Ping Tseng (Miaoli Co... और पढ़ें

US Patent Issued to Yangtze Memory Technologies on June 9 for "Chip package structure and manufacturing methods for the same" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,033, issued on June 9, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Chip package structure and manufacturing method... और पढ़ें

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