ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,962, issued on April 7, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.). "System and method for bonding tr... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,963, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Methods of manufacturing semiconductor devic... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,964, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Hardmask integration for high aspect ratio applications" was invented... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,965, issued on April 7, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "3D NAND memory device with isolation trenches... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,966, issued on April 7, was assigned to IMEC VZW (Leuven, Belgium). "Method for producing a through semiconductor via connection" was inven... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,967, issued on April 7, was assigned to Tencent Technology (Shenzhen) Co. Ltd. (Shenzhen, China). "Through silicon via interconnection stru... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,968, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of forming patterned structures" was invented by... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,969, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Flexible monomer for smooth polymer surface" was inv... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,970, issued on April 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Top via on subtractively etched conductive l... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,971, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Conductive via with improved ga... Read More