US Patent Issued to Tencent Technology (Shenzhen) on April 7 for "Through silicon via interconnection structure and method of forming same, and quantum computing device" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,967, issued on April 7, was assigned to Tencent Technology (Shenzhen) Co. Ltd. (Shenzhen, China).

"Through silicon via interconnection structure and method of forming same, and quantum computing device" was invented by Dengfeng Li (Shenzhen, China), Wenlong Zhang (Shenzhen, China) and Kunliang Bu (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A through silicon via interconnection structure and a method of forming same, and a quantum computing device are provided. The method includes: providing a silicon wafer, having a first surface and a second surface opposite to each other; forming, in the silicon wafer, a through silicon via pen...