US Patent Issued to IMEC VZW on April 7 for "Method for producing a through semiconductor via connection" (Belgian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,966, issued on April 7, was assigned to IMEC VZW (Leuven, Belgium).

"Method for producing a through semiconductor via connection" was invented by Douglas Charles La Tulipe (Heverlee, Belgium), Anne Jourdain (Grez-Doiceau, Belgium) and Gaspard Hiblot (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed technology relates to methods for producing an interconnect structure on the back side of an integrated circuit chip. According to a first aspect, a via opening is etched in a top semiconductor layer, and filled with a sacrificial material, thereby forming a sacrificial pillar. Then front and back end of line portions are proce...