ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,008, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Transistor with source manifold in non-active die region" was invent... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,009, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure" was invented by ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,010, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic packages with embedded interposers" was invente... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,011, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,012, issued on April 7, was assigned to Hitachi Energy Ltd (Zurich). "Free configurable power semiconductor module" was invented by Juergen... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for stacked memory-on-package (SMOP) and... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package device and manufacturing method thereo... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... Read More