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US Patent Issued to Infineon Technologies on Nov. 3 for "3D-IC for RF applications" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,881, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "3D-IC for RF applications" was invented by Hans Taddi... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,882, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... और पढ़ें


US Patent Issued to MediaTek on Nov. 3 for "Semiconductor package and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,883, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package and fabrication method thereof" was inve... और पढ़ें


US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Semiconductor device having deep trench capacitor and method for making same" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,884, issued on Nov. 3, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device having deep t... और पढ़ें


US Patent Issued to AUO on Nov. 3 for "Electronic apparatus and method of fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,885, issued on Nov. 3, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Electronic apparatus and method of fabricating the same" was invented ... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Semiconductor device with spacer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,886, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with spacer and method for fa... और पढ़ें


US Patent Issued to LUMILEDS on Nov. 3 for "Polychromic LED stack" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,887, issued on Nov. 3, was assigned to LUMILEDS LLC (San Jose, Calif.). "Polychromic LED stack" was invented by Zhongmin Ren (Danville, Cali... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Structure and formation method of package with interposer chip" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,888, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Structure and formation method of pac... और पढ़ें


US Patent Issued to ROHM on Nov. 3 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,889, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Tomohira Kikuchi (Kyoto, Japan).... और पढ़ें


US Patent Issued to Samsung Display on Nov. 3 for "Display device and tiled display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,890, issued on Nov. 3, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and tiled display device including... और पढ़ें