ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,828, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor de... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,829, issued on Nov. 3, was assigned to Absolics Inc. (Covington, Ga.). "Packaging substrate having cavity portions and method of manufacturi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,830, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and substrate for sem... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,831, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having a double via" was... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,832, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fabri... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,833, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Interconnect substrate, method of making the sa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,834, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of package struc... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,835, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonded structure with interconnect... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,836, issued on Nov. 3, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "Light emitting device having cantilever electrode, LE... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,837, issued on Nov. 3, was assigned to FASFORD TECHNOLOGY Co. LTD. (Minami-Alps, Japan). "Dipping apparatus, die bonding apparatus, and manu... Read More