US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a double via" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,831, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having a double via" was invented by Joonghyun Baek (Suwon-si, South Korea), Hyunsoo Chung (Suwon-si, South Korea), Dongok Kwak (Suwon-si, South Korea) and Eunjeong Im (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package having a lower redistribution structure includes a redistribution insulation layer, a plurality of ball pads in the redistribution insulation layer apart from one another, a double via which includes a first active via and a dummy via located on at least one of the plurality of b...