ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,829, issued on Nov. 3, was assigned to Absolics Inc. (Covington, Ga.).

"Packaging substrate having cavity portions and method of manufacturing the same" was invented by Sungjin Kim (Covington, Ga.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment relates to a packaging substrate and a method of manufacturing the same. The packaging substrate according to the embodiment includes a core layer, wherein the core layer may include a glass substrate including a first surface and a second surface facing each other, and at least two or more cavity portions each having an opening open in a direction toward the first surface or a direction toward th...