ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,818, issued on Nov. 3, was assigned to X-Celeprint Ltd. (Dublin). "Printed devices in cavities" was invented by Antonio Jose Marques Trindad... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,819, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Package substrate comprising embedded integrated device" was invented by ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,820, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Keunho ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,821, issued on Nov. 3, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "High-symmetrical semiconductor arrangement" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,822, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Integrated electronic module with laminated bridge assembly... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,823, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Stacked vertical power module" was invented by John David B... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,824, issued on Nov. 3, was assigned to KYOCERA Corp. (Kyoto, Japan). "Semiconductor package and semiconductor electronic device" was invente... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,825, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce impedance discontinuities and cro... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,826, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,827, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Multi-die QFN hybrid package" was invented by Hsin-Long Chen (... Read More