US Patent Issued to QUALCOMM on Nov. 3 for "Package substrate comprising embedded integrated device" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,819, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego).

"Package substrate comprising embedded integrated device" was invented by Hong Bok We (San Diego), Joan Rey Villarba Buot (Escondido, Calif.), Sang-Jae Lee (San Diego) and Zhijie Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprising a substrate and a second integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first plurality of interconnects, and a first integrated device located at least partially in the substrate. The first integrated device is coupled to the first plurality of interconnects t...