US Patent Issued to MediaTek on Nov. 3 for "Multi-die QFN hybrid package" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,827, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Multi-die QFN hybrid package" was invented by Hsin-Long Chen (Hsinchu City, Taiwan) and Chin-Chiang Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-die QFN hybrid package includes a carrier having flip-chip leads and wire-bonding leads. A first die and a second die are mounted on the flip-chip leads, respectively, in a flip-chip manner. The first die is spaced apart from the second die. A third die is stacked over the first die and the second die. The third die is electrically connected to the wire-bonding leads around the first die and th...