US Patent Issued to KYOCERA on Nov. 3 for "Semiconductor package and semiconductor electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,824, issued on Nov. 3, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Semiconductor package and semiconductor electronic device" was invented by Shigenori Takaya (Kyoto, Japan), Hironobu Fujiwara (Kyoto, Japan) and Emi Mukai (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a base including a first surface including a first side and a second side coupled to the first side; a wiring laminate located on the first surface, extending along the first side of the first surface, and including a second surface extending along the second side; and a peripheral wall portion, together with the wiring laminate, surrou...