US Patent Issued to International Business Machines on Nov. 3 for "Resistance temperature detector at hybrid bonding interface" (New York Inventors)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,793, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Resistance temperature detector at hybrid bond... Read More

US Patent Issued to Qorvo US on Nov. 3 for "Front-end module with vertically stacked die and circulator" (North Carolina, California Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,794, issued on Nov. 3, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Front-end module with vertically stacked die and circulator" was i... Read More

US Patent Issued to International Business Machines on Nov. 3 for "Modular package structures with interposers having alignment features" (New Jersey, Connecticut, New York Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,795, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Modular package structures with interposers ha... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Package-on-package (POP) type semiconductor packages" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,796, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Package-on-package (POP) type semiconductor pa... Read More

US Patent Issued to MOSAIC MICROSYSTEMS on Nov. 3 for "Facilitating formation of a via in a substrate" (New York Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,797, issued on Nov. 3, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.). "Facilitating formation of a via in a substrate" was inven... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Method of fabricating semiconductor package" (South Korean Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,798, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... Read More

US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Semiconductor module and manufacturing method therefor" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,799, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and manufacturing method therefor" wa... Read More

US Patent Issued to Rohm on Nov. 3 for "Semiconductor device with different side surfaces thickness for a plurality of leads that extend outside the package" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,800, issued on Nov. 3, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device with different side surfaces thickness for a plur... Read More

US Patent Issued to Mitsui High-tec on Nov. 3 for "Metal component including conductive substrate with nickel layer and noble metal layer" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,801, issued on Nov. 3, was assigned to Mitsui High-tec Inc. (Fukuoka, Japan). "Metal component including conductive substrate with nickel la... Read More

US Patent Issued to Valeo Equipements Electriques Moteur on Nov. 3 for "Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding" (French Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,802, issued on Nov. 3, was assigned to Valeo Equipements Electriques Moteur (Creteil Cedex, France). "Power module with overmoulding, device... Read More

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US Patent Issued to International Business Machines on Nov. 3 for "Resistance temperature detector at hybrid bonding interface" (New York Inventors)

US Patent Issued to Qorvo US on Nov. 3 for "Front-end module with vertically stacked die and circulator" (North Carolina, California Inventors)

US Patent Issued to International Business Machines on Nov. 3 for "Modular package structures with interposers having alignment features" (New Jersey, Connecticut, New York Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Package-on-package (POP) type semiconductor packages" (South Korean Inventors)

US Patent Issued to MOSAIC MICROSYSTEMS on Nov. 3 for "Facilitating formation of a via in a substrate" (New York Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Method of fabricating semiconductor package" (South Korean Inventor)

US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Semiconductor module and manufacturing method therefor" (Japanese Inventor)

US Patent Issued to Rohm on Nov. 3 for "Semiconductor device with different side surfaces thickness for a plurality of leads that extend outside the package" (Japanese Inventor)

US Patent Issued to Mitsui High-tec on Nov. 3 for "Metal component including conductive substrate with nickel layer and noble metal layer" (Japanese Inventors)

US Patent Issued to Valeo Equipements Electriques Moteur on Nov. 3 for "Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding" (French Inventors)