US Patent Issued to International Business Machines on Nov. 3 for "Modular package structures with interposers having alignment features" (New Jersey, Connecticut, New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,795, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Modular package structures with interposers having alignment features" was invented by Jae-Woong Nah (Closter, N.J.), David Abraham (Croton, N.Y.), John Michael Cotte (New Fairfield, Conn.) and Muir Kumph (Croton-on-Hudson, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure comprises a first interposer, a second interposer, and a quantum chip. The first interposer comprises a first alignment feature. The second interposer comprises a second alignment feature. The quantum chip is bonded to the first interposer with an extended portion of ...